With lead-free soldering processes approved and implemented, increased emphasis is placed on rework and repair as a significant challenge. Considered a weak link in the lead-free process control chain, lead-free soldering requires rigorous control of the thermal process given the higher processing temperatures and reduced process window. The paradox between higher process temperatures of lead-free alloys and the thermal threshold of electronic components during the rework and repair process forms the basis of the lead-free challenge. How reliable is your rework?

IPC and JEDEC are pleased to present the International Conference on Reliability, Rework, and Repair of Lead-Free Electronics, March 11-12, 2008, in Raleigh, North Carolina. This conference will address the issues faced as a result of implementing a lead-free process such as alloy choices, component compatibility and solder concerns.

Registration Information
Please pre-register by March 1, 2008, to secure your seat at this event. Complete the registration form and fax or mail to IPC. The technical conference and tabletop displays will be held on March 11, 2008. Please see the conference agenda for specific times. For more information, or if the registration deadline has passed, contact an IPC registration representative at +1 847-597-2861 or send an e-mail to registration@ipc.org.

Cancellation Policy: Cancellations received before March 10, 2008 will be refunded in full. Refunds will not be issued after the start of the program. Individuals failing to cancel will be billed for the registration fee. If the events are cancelled, participants will receive a full refund. If you are unable to attend, you may send a co-worker in your place.

Location and Hotel Accommodation

The technical conference and educational courses will take place at the Sheraton Raleigh Hotel, 421 S. Salisbury Street, Raleigh, N.C. To reserve your room, contact the hotel directly at +1 919-834-9900 and ask for the IPC/JEDEC conference rate of $139 (single/double) per night. Rate is subject to change after February 17, 2008.

Tabletop Exhibits

Attendees will visit the tabletop display area during the conference breaks and lunches on March 11, 2008. For pricing information and tabletop application here(.pdf).

Sponsorship Opportunities

Suppliers, manufacturers, and users of lead-free electronics will be in attendance at this conference. Your company can showcase its services and products as a tabletop exhibitor or take advantage of one of the many sponsorship opportunities available for this conference.

View the list of available sponsorship opportunities here (.pdf) or contact Alexandra Curtis at +1 847-597-2877 or via e-mail at AlexandraCurtis@ipc.org.

Media Sponsors

This course is split into two sessions; lead-free rework basics, and advanced lead-free rework methods. Each session will consist of both classroom instruction and limited hands on exposure to various methods of rework (actual hands on time will be determined by the number of participants).

Topics to be Covered

The morning session will focus on the materials (flux, solder, etc.) used in the lead-free rework process, and the methods for performing the lead-free rework process. Special emphasis will be given to through-hole rework, basic SMT and acceptance criteria.

The afternoon session will cover advanced issues regarding lead-free rework, including fine-pitch SMT replacement, and BGA replacement and reballing.

Who Should Attend

This course is for anyone who is currently performing, or contemplating performing lead-free rework of electronic assemblies. It is recommended for engineers, managers, and equipment/hand soldering personnel.

About the Instructor

Ray Cirimele is the Operations Manager of Business Electronics Soldering Technologies, Inc. Cirimele is an international speaker in electronics manufacturing and has over twenty years experience in the industry performing electronics maintenance, manufacturing, PCB fabrication, rework and repair, sales and training. Cirimele's educational background includes a Bachelor of Technical Education from National University in San Diego.

Dan Foster is the Director of Training Services for STI Electronics Incorporated in Madison, Alabama. Foster has over 25 years experience in electronics rework and repair. He is the co-chair of IPC 7711/7721 Rework, Repair and Modification of Printed Boards and Electronic Assemblies Committee and vice-chair of the IPC-STD-001 Requirements for Soldered Electrical and Electronic Assemblies. Foster is accredited by IPC as a Master Instructor for IPC-A-600, IPC-A-610, IPC/WHMA-A-620, IPC J-STD-001 and IPC-7711/7721 and conducts IPC Certification Training Courses.

This tutorial provides a broad view of attachment reliability issues and trends for popular lead-free alloys such as SnAgCu (SAC). It is technical and pulls together a wide range of data, material properties, test and modeling results. Fundamental differences between SnPb and lead-free solders will be highlighted as well as recent progress in understanding lead-free solder joint reliability. Upon completion of the tutorial, attendees will gather that of seemingly confusing test results can, indeed, be turned into useful reliability information.

The performance of lead-free and mixed assemblies will be compared to SnPb assemblies and risk areas identified. Accelerated test results will be presented. Material properties and fatigue curves will explain differences in the reliability of SnPb and lead-free assemblies. Strain-energy-based life prediction models and acceleration factors will be presented that compare test efficiency for SnAgCu and SnPb assemblies and illustrate how to extrapolate lead-free test results to product-use conditions, the true measure of lead-free assembly reliability.

Topics to be Covered

• An overview of trends in lead free vs. SnPb accelerated testing results
• Lead free vs. lead free: why all SAC alloys are not the same, reliability differences
• Identify potential risk areas (metallurgical risks, ductile-to-brittle transition, interfacial failure)
• How to plan for lead-free product reliability assurance, and why inferior test results do not necessarily imply lessened product reliability
• Gain understanding of fundamental differences in microstructure, creep mechanisms and the thermo-mechanical response of SnPb and SAC alloys
• Understand the effect of thermal cycling dwell times on the relative lives of SnPb and SAC assemblies
• Find out how to optimize lead-free accelerated thermal cycling profiles for maximum efficiency (and reduced cost) without lengthening test duration
• How to interpret test results; strain-energy based life prediction models; examples of acceleration factors for SAC assemblies, including validation data

Who Should Attend

Design, materials, manufacturing, quality or reliability professionals and managers who are responsible for, or plan to implement, lead-free assembly technologies in their companies' products.

About the Instructor

Dr. Jean-Paul Clech is a consultant specializing in surface mount assembly quality and reliability assurance who has served as an expert witness in product failure cases. He has worked on small and large circuit boards for applications in mild to harsh environments. Dr. Clech authored more than 40 papers and has been an invited speaker at events worldwide. He holds degrees in materials science and mechanical engineering.

The topic of whether or not lead free is reliable enough for harsh environment electronics will be rationalized by addressing 20 key questions. Based on the sustained development effort, testing data and manifold evaluations, this workshop dissects what it takes to perform in a harsh environment and the rationale behind it. The question on whether a life-prediction model can assure reliability will be discussed. A relative reliability ranking among viable systems, as well as the scientific, engineering and manufacturing reasons behind the ranking will be outlined.

Topics to be Covered

• Underlying technical issues of PTH/PTV failures and the importance of circuit board design, material choices and processing
• The impact on PTH/PTV quality and reliability of the drilling, desmearing and plating processes
• PTH/PTV material interactions and load drivers from processing steps, assembly, screening procedures and use environments; as well as the design parameters, especially of small-diameter/high-aspect-ratio plated-through vias (PTVs)
• Use of a state-of-the-art, but practical, reliability estimation model based on an accelerated testing database from the IPC Round Robins, Bell Labs and others
• Information about the IPC Round Robins on the reliability of small-diameter high-aspect-ratio PTVs and on inner-layer separation (post separation)
• Execution of a successful “Design for Reliability” to assure the quality and reliability of the PTH/via connections in your electronic system

Who Will Benefit

The course is recommended for anybody concerned with the reliability of electronic assemblies and involved in any aspect of the design, assembly and application of PCBs for high-density electronic packaging.

About the Instructor

Werner Engelmaier has over 42 years experience in electronic packaging and interconnection technology and is the president of Engelmaier Associates, L.C., a firm providing consulting services on reliability, manufacturing and processing aspects of electronic packaging and interconnection technology. He is the author of more than 170 technical publications and has been recognized for his work and industry leadership with numerous awards.

The switch to lead-free solder raises issues on the manufacture, processing and reliability of lead-free electronic products. Adequate reliability of surface mount solder attachments can only be assured with a “design for reliability” based on solder joint behavior and the underlying fatigue damage mechanisms. Processing consistency and the quality of the resulting electronic assemblies, while of course necessary, are not the only parameters of reliability.

The physics-of-failure and failure statistics underlying SnPb solders in industry documents took over 30 years to develop. The available information for creep-fatigue behavior in lead-free solders is inadequate to determine the acceleration factors and to develop creep-fatigue models.

In this workshop, appropriate testing, which is even more important given the lack of acceleration factors for lead-free solders, to assess the extent of the various reliability threats will be discussed. Strategies to assure the reliability of solder attachments, printed circuit boards (PCBs), and components in electronic product subjected to lead-free soldering will be explained.

Topics to be Covered

• Reliability design considering the field use environment, product design life and the acceptable failure risk level.
• The complex nature of the interacting mechanisms underlying thermally induced solder joint fatigue combined with the highly temperature-, time- and stress-dependent behavior of solder will be explored. The special reliability threats to the solder attachments and to the printed circuit board (PCB) substrates and components based on using lead-free solders will be discussed.
• Load drivers and the resulting failure modes will be covered and illustrated by pertinent examples and illustrations.
• Solder attachment reliability can only be assured by understanding all the factors impacting the loading conditions on the solder joints.
• Solder creep-fatigue behavior as well as thermal cycling, vibration and mechanical shock are explained. The information on lead-free solders, which often seems contradictory, will be put into context with the creep-fatigue behavior of SnPb solders.

Who Will Benefit

The course is for anyone concerned with solder attachment reliability and those involved in any aspect of the design, assembly and application of surface mount technology and electronic packaging. Individuals involved in soldering, quality assurance and reliability for severe use environments and/or long product lives, such as telecommunications, military, automotive or satellite applications will benefit.

About the Instructor

Werner Engelmaier has over 42 years experience in electronic packaging and interconnection technology and is the president of Engelmaier Associates, L.C., a firm providing consulting services on reliability, manufacturing and processing aspects of electronic packaging and interconnection technology. He is the author of more than 170 technical publications and has been recognized for his work and industry leadership with numerous awards.

Looking for Savings?

• Early Registration - Register by February 11, 2008, and save an additional 10% off of the prices shown below.
• Group Discount - Register three individuals from your company at the same time and receive the fourth
  registration FREE. * Note: The discount will apply to the lowest cost registration.