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Meeting the requirements of RoHS compliance and successfully implementing lead-free electronics assembly processes is an ongoing challenge for the industry. Find new strategies for implementation at IPC and JEDEC’s conference on Transitioning to Lead Free — Strategies for Implementation, March 3-5, 2009 in Santa Clara, Calif. The event features a full-day technical conference with an outstanding roster of speakers on a host of lead-free topics. Two full days of informative half-day workshops will be offered as well.
A variety of registration options are available to meet every need.
Register by February 9, 2009 and SAVE
10%. Location & Hotel Accommodations The technical conference and workshops will be held at the Marriott Santa Clara, 2700 Mission College Blvd, Santa Clara, Calif. To reserve your sleeping room, please contact the hotel at 888-236-2427 or +1 408-988-1500 and ask for the JEDEC/IPC Lead-Free special rate of $179 per night. Rooms and rate are subject to change after February 9, 2009. |
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PD-01: Four Ps of SMT in a Lead-Free World: Principles, Practice, Promises and Problems Tuesday,
March 3, 2009 |
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Workshop Instructor: Ray
Prasad |
There is no doubt that lead-free has impacted almost everyone in the electronics industry, from suppliers of components, boards and materials to manufacturers and users of electronic products and equipment, including the military and medical industry. The lead-free train has been moving fast. Even if you work in a currently exempt industry, you need to get on board or risk losing market share to competitors, particularly when the leaded products and components you are using become only available in lead free. Learn how to resolve issues for an effective implementation of SMT in a lead-free world at a lower cost and higher yield. The objective of this course is to identify the technical issues in through hole, SMT, BGA, fine-pitch technology and the impact of lead free that must be resolved for an effective implementation of mixed assembly electronic products for both tin-lead and lead free. What You Will Learn:
Who Should Attend: Anyone in process, quality, manufacturing, design, purchasing and management that wants to get a good understanding of SMT, lead free, fine pitch, and BGA manufacturing issues for building assemblies in-house or at a subcontractor will benefit from this course. About the Instructor: Prior to starting his consulting practice providing SMT solutions, Ray Prasad held key technology positions at Boeing and Intel. At Intel, he was responsible for developing and implementing SMT. He has published a text book, chaired the committee that drafted IPC-7095 and received the IPC Presidents Award. He received his B.S. in metallurgical engineering from the Regional Institute of Technology, Jamshedpur, India, and both his M.S. in materials science and engineering and his M.B.A. from U.C. – Berkeley. |
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PD-02: Lead-Free Soldering Processes - Survival, Quality, Reliability Tuesday,
March 3, 2009 |
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Workshop Instructor: Werner
Engelmaier |
The threat to the reliability of electronic products comes from three sources: solder joint reliability, printed circuit board survival during soldering (and long-term reliability) and component survival of soldering processes. This course will examine each of these threats in detail and explore solutions that can help assure the survival and reliability of electronic assemblies. What You Will Learn:
Who
Should Attend: About
the Instructor: |
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| TECHNICAL CONFERENCE AGENDA - Wednesday, March 4, 2009 | |||||||||||||||||||||||
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The technical conference will begin on Wednesday, March 4 at 8:30 am and will conclude at 5:00 pm.
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PD-03: Lead-Free Systems Performance & Reliability - Present & Future Thursday
March 5, 2009 |
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Workshop Instructor: Jennie
Hwang, Ph.D. |
This course provides a holistic view of state-of-the-art lead-free performance and reliability, as well as what is on the horizon. A wide array of global production results and product field performance have been generated during the last decade. Some were deemed positive and some remain to be resolved, and some test results may appear not to be coinciding with others. Yet all product performance and test results manifest the criticality of sound practice. The course will highlight the sound practice in all key areas of lead-free electronics. Based on the speaker’s three textbooks, representative test results will be illustrated. New developments and their impact on product performance and reliability will also be discussed. What You Will Learn:
Who Should Attend: The course provides a proper level of working knowledge to all that are involved with or interested in the production and reliability of lead-free packaging and assembling; also designed for those who desire broad-based information. About the Instructor: Dr.
Hwang has in-depth practical experience in SMT manufacturing, lead-free
R&D, production implementation and lead-free reliability. She
has also served as an advisor to major OEMs, EMS companies and the
U.S. government. She has Ph.D., M.S., M.A. and B.S degrees in materials
science and engineering, chemistry and liquid crystal science, respectively.
Dr. Hwang has received numerous honors and awards for her work,
and is the author of more than 300 publications, including several
textbooks. She serves on the boards of many companies, civic groups
and universities and is also an invited adjunct professor for the
engineering school of Case Western Reserve University and serves
on the University's board. |
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PD-04: BGA/CSP WLP Lead-Free Reliability in Packaging & Assembly Thursday
March 5, 2009 |
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Workshop Instructor: Jennie
Hwang, Ph.D. |
This course addresses critical questions and tackles prevalent issues related to lead-free BGA packages and assemblies. What are potential BGA lead-free issues? Should BGA solder balls become molten during reflow? How the process affect the production yield? How the process affect the assembly reliability? Can SAC ball and SnPb solder paste or vice versa work well? Can SAC ball and other lead-free solder paste work well? Can SAC ball and SAC solder paste work for harsh environment electronics? What it takes to produce acceptable lead-free BGA assemblies? What doesit takes to produce the reliable lead-free BGA assembly for harsh environment electronics? In view of the intricate makeup of BGA components on PCBs and its impact on reliability, the compatibility scenarios of BGA/CSP in SAC alloy and other lead-free alloys and the mixed use of Pb-free and SnPb will be outlined. The impact of reflow process on reliability will be discussed. BGA/CSP/WLP assemblies that are being practiced and/or recommended in the industry will be ranked in performance and reliability, particularly for harsh environment electronics. Reliability data on solder ball attachment in producing BGA packages will also be presented. Additionally, the course summarizes the scientific and manufacturing rationale behind the performance. Attendees are encouraged to bring their own production and reliability issues for discussion and solution. What You Will Learn:
Who Should Attend: The course provides a practical working knowledge to anybody who is involved with or interested in the reliability and relative performance of lead-free packages and PCB assemblies, particularly in BGA, CSP, LGA array interconnections. This course is also designed for those who desire the reasons behind the performance and the test data vs. performance. About the Instructor: Dr. Hwang has in-depth practical experience in SMT manufacturing, lead-free R&D, production implementation and lead-free reliability. She has also served as an advisor to major OEMs, EMS companies and the U.S. government. She has Ph.D., M.S., M.A. and B.S degrees in materials science and engineering, chemistry and liquid crystal science, respectively. Dr. Hwang has received numerous honors and awards for her work, and is the author of more than 300 publications, including several textbooks. She serves on the boards of many companies, civic groups and universities and is also an invited adjunct professor for the engineering school of Case Western Reserve University and serves on the University's board.
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PD-05: Understanding Failure and Root-Cause Analysis in Lead-Free Electronics Thursday,
March 5, 2009 |
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Workshop Instructor: John McNulty, DfR Solutions |
Get an in-depth understanding of failure mechanisms unique to lead-free electronics, and the tools and techniques to identify those mechanisms. Mechanisms will be addressed for component packaging, discrete components, printed circuit boards and interconnects. A physics of failure (PoF) based approach will be taken, identifying drivers such as defect-driven, overstress and wearout, and how an understanding of these stress-strength interactions can provide guidance on the appropriate corrective and action. A wide variety of case studies will be presented, including red phosphorus in epoxy encapsulants, creepage corrosion in immersion silver and solder joint failures. What You Will Learn:
Who
Should Attend: About the Instructor: Dr.
McNulty has worked on the packaging, reliability, and failure analysis
of structural, medical, micro-electronic, and opto-electronic devices
for 20 years. He has been with DfR Solutions since May 2007 as a
senior member of technical staff and West Coast office manager.
He has worked with customers such as Cisco, HP, Huawei, and Juniper
on Pb- and Pb-free solder reliability issues, and has given presentations
on Pb-free to over 40 companies. He was previously manager of reliability
for Coherent’s semiconductor laser business unit, and director
of reliability for Iolon, Inc. (a manufacturer of tunable telecommunications
components).
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PD-06: A Practical Guide to Managing Your Lead-Free Transition Thursday,
March 5, 2009 |
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Workshop Instructor: Randy
Schueller |
This course will teach the critical and practical elements of successfully transitioning a company’s products to lead free. What You Will Learn:
Completion of this course should prepare students for creating a comprehensive lead-free development plan for their own products. About the Instructor: Randy
received his Ph.D. in materials science engineering from the University
of Virginia in 1992 and then spent seven years at 3M leading a team
in the development of numerous flex based IC packages. He then joined
Extreme Devices (an Austin high tech start-up) where he spent four
years as IC packaging and engineering director. Schueller moved
to Dell in 2003 to assist in the lead-free transition of Dell products.
As Sr. Manager of Dell’s component engineering and failure
analysis groups, Schueller has spent the past 5 years at the forefront
of successfully guiding Dell to lead-free on all their products,
including class A servers. Schueller has 15 patents and has authored
and presented over 30 papers for the electronics industry. |
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Suppliers, manufacturers and users will be in attendance at this conference. Your company can showcase its services and products as a tabletop exhibitor, or take advantage of one of the many sponsorship opportunities available for this conference. View the list of available sponsorship opportunities here (.pdf) or contact Michelle Michelotti at +1 847-597-2822 or via e-mail at MichelleMichelotti@ipc.org. Media Sponsors
We expect a strong turnout for the tabletop display area during the conference breaks and lunch on March 4, 2009. Don't miss out on this opportunity to reach your audience. Get pricing information and a tabletop application here (.pdf).
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